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PI glue and BCB glue are commonly used in semiconductor, microelectronics and precision manufacturing related processes. The curing process has high requirements on temperature curve, cleanliness, oxygen environment and process repeatability. If the curing environment is unstable, contamination, bubbles, oxidation, surface defects or batch differences may occur. Therefore, PI/BCB glue curing cannot simply use an ordinary oven, and needs to be evaluated in combination with a clean oven, a low-oxygen oven, or customized heat treatment equipment. ESSENSCIEN Instruments can provide clean ovens, vacuum ovens, nitrogen-filled vacuum ovens, non-oxidizing ovens, high-temperature ovens and non-standard customized equipment, suitable for semiconductor materials and

Clean oven is a drying equipment that further focuses on cleanliness and pollution control on the basis of temperature control. The difference between it and ordinary ovens is not only that it has a more sophisticated appearance, but also has higher requirements in terms of box structure, filtration system, air duct design, material selection and operating environment. For users of semiconductors, electronic manufacturing, medical devices and precision materials, clean ovens can reduce the impact of particle contamination and environmental fluctuations on samples. ESSENSCIEN instrument products cover clean ovens, vacuum ovens, nitrogen-filled ovens, high-temperature ovens, non-oxidation ovens and industrial customized equipment. They can be customized according to user cleanliness, temperature control, anti-oxidation and